Next generation active nanodevices will enable greater functionality in smaller
packages, providing the basis for a broad range of high tech products.
One of the barriers to this innovation is heat (power) dissipation, i.e.,
the problem of thermal management.
Thermal conductivity/diffusivity in complex geometries requires measurement
techniques beyond the current state of the art.
Measurements that can provide insight into the effects of defects,
interfaces, and molecular anisotropy on the thermal characteristics of
nanodevices are critically needed.
Objective
To develop measurement techniques for characterizing the thermal properties
of polymeric materials in active nanodevices as a function of defects,
interfaces, and nanostructure.
NIST Role
Develop practical ways to extend the capability of current thermal
conductivity/diffusivity measurement instrumentation, e.g.,
via combinations of current techniques with controlled testbeds
Develop appropriate testbeds, with controlled defects, interfaces,
molecular anisotropy, and 3-dimensional geometries, to enable
quantification of nanoscale effects, e.g., spatial confinement of
phonons at the nanoscale and thermal boundary resistance
Approach
Combinatorial Simultaneous Dielectric and Thermal Diffusivity (SDTD)
Spectrometer to obtain the thickness dependence of the thermal
conductivity and heat capacity.
Defects, controlled interfaces, controlled thermal conductivity of
phases, and long range order effects using a Testbed based on
controlled geometry Block Copolymers (BCPs) with selective filling
of nanoparticles for localized enhancement of thermal conductivity.
NIST Contributors
Chad R. Snyder*
Kirt Page
Alamgir Karim
Joong Tark Han
Brian Berry
Eric J. Amis
Collaborators:
Ho-Cheol Kim (IBM Almaden)
Nanostructured Materials Group
Polymers Division
Materials Science and Engineering Laboratory
