Today's U.S. microelectronics
and supporting infrastructure industries are in fierce international
competition to design and produce new smaller, lighter, faster, more
functional, and more reliable electronics products more quickly and
economically than ever before.
Recognizing this trend, in 1994
the NIST Materials Science and Engineering Laboratory (MSEL) began
working very closely with the U.S. semiconductor, component and packaging,
and assembly industries. These early efforts led to the development
of an interdivisional MSEL program committed to addressing industry's
most pressing materials measurement and standards issues central to
the development and utilization of advanced materials and material
processes within new product technologies, as outlined within leading
industry roadmaps1. The vision that accompanies this program - to
be the key resource within the Federal Government for materials metrology
development for commercial microelectronics manufacturing - may be
realized through the following objectives:
develop and deliver standard measurements and data;
develop and apply in situ measurements on materials and material assemblies
having micrometer- and submicrometer-scale dimensions;
quantify and document the divergence of material properties from their
bulk values as dimensions are reduced and interfaces contribute strongly
to properties;
develop fundamental understanding of materials needed in future microelectronics